Novel SiC wafer manufacturing process employing threestep slurryless ...
The proposed threestep ECMP manufacturing process (Fig. 1) involves (1) ECMP with hard abrasives, (2) ECMP with soft abrasives at a high current density (potential), and (3) ECMP at a potential equal to or less than the passivation the first step, hard abrasives were used to induce the shallow SSD layer on the SiC surface to increase the anodic oxidation rate, thus rapidly ...